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Diffusion bonding Manifolds

Overview

Diffusion bonding manifolds techniques give by a long shot the most plan adaptability and capacity when fabricating medical manifolds. Welink’s high exactness diffussion bonding procedures enable to create multi-layer, three dimensional directed plastic manifolds, with a tight resiliences and repeatable quality.

The plastic materials, normally Acrylic (PMMA) or Ultem (PEI) are essentially bonded utilizing warmth and strain to make a sub-atomic bond and maintaining a strategic distance from the utilization of potential contaminants, for example, cements, concretes or solvents. Diffusion bonding manifolds at Welink are created from completely heat treated materials, which are then precious stone processed to guarantee they are level and equal preceding the machining of the tracks and bonding. Post boding highlights are then machined and extra parts included as required. As diffusion bonding manifolds are machined and fortified (contrasted with cross-penetrated), they offer the structure engineer the capacity to present smooth stream ways and complex inner highlights which can’t be accomplished utilizing traditional machining or embellishment systems. Interior tracks can be machined to different widths to make limitations, stores, blending chambers and numerous different highlights for controlling fluids.

The technology is same as Acrylic Manifolds,  and we improved based on controlledfluidics.

Features of fluidic manifolds

• Reduced overhauling costs

• Reduced get together time and expenses

• Improved unwavering quality

• Reduced part tally and expenses

• Significant decrease in potential break focuses

• Eliminate the potential for mistaken associations in get together and overhauling

• Reduction in dead volumes of diffusion bonding manifolds

• Visualizing of framework activity

• Optical example examination

• Easy identification of framework deficiencies and blockages

• Manifold as a mechanical segment can be utilized as a major aspect of the case

• Component mix and etching/stamping

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